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How to Choose the Next Generation of Wide Bandgap Semiconductor Materials Beyond GaN and SiC
2023-07-11

When Si can’t meet the demands of high-speed transmission & high voltage, it’s imperative to find the best wide bandgap material to replace…

Overcoming Compatibility Challenges in USB Type-C Display Dual Functionality
2023-06-13

USB Type-C become the dominant standard of combining file transfer, video output & charging funtion but the compatibility issues remain a challenge…

How to Interpret the Brightness and Darkness of TEM Images to Unlock the Secrets of Materials
2023-05-23

Although it is the same TEM black and white image,there can be drastically different interpretations. What knowledge lies between the black and white of TEM images, and how to ensure that you are on the correct side?

Crystal Structures in Materials: The Key to Unbeatable Semiconductor Advanced Packaging
2023-05-16

When Moore’s Law reaches its limit, can advanced packaging be successfully developed? Master the crystal structure depends on the tool – EBSD…

Lost in Inertia: Is Inertia Thinking Distorting Your TEM Results?
2023-04-25

Inertia thinking may enable you to become more proficient, but it may also lead us to a wrong direction in TEM sample preparation…

New TEM Auto Metrology Helps Overcome 2nm Manufacturing Bottleneck
2023-04-13

TEM Auto Metrology, a precise and quick software newly developed by iST as an alternative to the traditional measurement methods. As manufacturing processes continue to shrink to 2nm, how to quickly and accurately measure parameters is a key to accelerate process development…