The surface mount technology (SMT) process is the very first factor affecting BLR tests. The quality of ICs mounted on simulation PCBs will determine the accuracy of product life cycle assessment. Key factors on quality are solder paste features, printing settings (such as stripping distance, stripping time, and printing speed), placement accuracy and selecting of steel plate.
The Superiority of iST
Large amount of voids due to SMT may lead to poor product life assessment
iST keeps void level at 10% or lower by adding reflow oven in SMT process
Contact Window | Mr. Chang/Allen | Tel: +886-3-5799909#6429 | Email:web_SMT@istgroup.com