A die must be linked with the substrate to fulfill its intended function; a wire bonding is to connect the signal from a die to the substrate.
What iST can do for you
iST is capable of meeting engineering requirements regarding IC wire bonding and assembly from rework, to wire patchup, to engineering sample preparation through to total project development.
The superiority of iST
iST offers sample dicing, wire bonding, ceramic or COB assembly followed by premium one-stop solution services for ESD/OLT analysis and verification to minimize test sample preparation time significantly.
Case Sharing
Driver IC bonding
COB bonding
FIB Pad bonding
Both the first and second joint are wedge-shaped, so the bonding direction has
to be parallel to the pad. Aluminum (Al) wire is normally used.
A ball-type joint at the first connection and a wedge joint at the second connection. The placement of bonding wire takes the center of the ball-type joints. Mainly bonded with Au and copper wires.
Mounting a ball on a solder pad. Mainly bonded with Au wires.
- PCB development and packaging projects
- Rework of rejected ICs sample preparation, backside sample preparation
- Planning of small-quantity production
- Push and pull test (Ball Shear/Wire Pull/Solder Ball Shear/Die Shear)
- Wire bonding/molding/capping
- Varieties of wire bonding methods: driver IC, COB, FIB Pad, chip-to-chip, ball mounting
- Wire bonding verification(Open/Short test)
Contact Window | Mr. Yang/Benson | Tel:+886-3-5799909#6862 | Email: web_ass@istgroup.com